The proof-of-concept TEG originally reported in 2017 employed semiconductor elements that were connected electrically in series using liquid-metal interconnects made of EGaIn – a non-toxic alloy of gallium and indium. EGaIn provided both metal-like electrical conductivity and stretchability. The entire device was embedded in a stretchable silicone elastomer.
The upgraded device employs the same architecture but it significantly improves the thermal engineering of the previous version, while increasing the density of the semiconductor elements responsible for converting heat into electricity. One of the improvements is an improved silicone elastomer – essentially a type of rubber – that encapsulates the EGaIn interconnects.
"The key here is using a high thermal conductivity silicone elastomer doped with graphene flakes and EGaIn," Ozturk said. The elastomer provides mechanical robustness against punctures while improving the device's performance.
"Using this elastomer allowed us to boost the thermal conductivity – the rate of heat transfer – by six times, allowing improved lateral heat spreading," he said.
Ozturk added that one of the strengths of the technology is that it eliminates the need for device manufacturers to develop new flexible, thermoelectric materials because it incorporates the very same semiconductor elements used in rigid devices. Ozturk said future work will focus on further improving the efficiencies of these flexible devices.
Yasaman Sargolzaeiaval, Viswanath P. Ramesh, Taylor V. Neumann, Veena Misra, Michael Dickey and Daryoosh Vashaee co-authored the paper. The group also has a recent patent on the technology.